Studio Headphones
ProductOverview
The studio headphones are over-ear, closed-back wireless cans with hybrid active noise cancelling. Each 40 mm dynamic driver is paired with feedforward and feedback microphones, and the set runs wirelessly over Bluetooth or wired over USB-C and 3.5 mm. A folding design and hard-shell case make them portable while retaining a full-size acoustic platform.
Construction
The Headband Assembly carries a sprung steel core under memory-foam padding and a PU cover, with detented sliders for height and gimbal yokes that let each cup swivel to the head. The yokes also locate the Folding Hinge joints that collapse the cups flat for storage in the Carrying Case.
Sound is produced in each Ear Cup Assembly. At its heart the Dynamic Driver combines a voice coil and neodymium magnet motor driving a lightweight diaphragm; acoustic mesh and felt behind the baffle tune the response and damp resonances, while a memory-foam ear pad seals against the head for passive isolation. A capacitive touch panel on the outer face and the ANC Microphone units sit on the same cup.
The Mainboard, housed inside one cup, carries a Bluetooth audio SoC, a dedicated ANC DSP, and a control MCU. The DSP combines the feedforward microphone (sensing noise outside the cup) with the feedback microphone (sensing residual noise at the ear) to generate an anti-noise signal that cancels ambient sound across a wide band.
Power comes from the Battery Pack pack: a LiPo cell with a protection BMS and a USB-C charge controller. The I/O Board exposes the USB-C and 3.5 mm jacks plus the power, pairing, and ANC-mode buttons.
Studio Headphones parts and their functions
7 top-level parts · 265 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Headband Assembly 7 parts | 1× | Sprung band + padding + sliders |
| 2 | Ear Cup Assembly 11 parts | 2× | Left + right ear cups |
| 3 | Mainboard 6 parts | 1× | BT SoC + ANC DSP, in one cup |
| 4 | Battery Pack 3 parts | 1× | LiPo pack + BMS + charge IC |
| 5 | I/O Board 5 parts | 1× | USB-C + 3.5 mm + buttons |
| 6 | Folding Hinge | 2× | Fold-flat hinges at the yokes |
| 7 | Carrying Case | 1× | Hard-shell travel case |
3D model
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Build & assembly graph
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Bill of materials for Studio Headphones
7 top-level lines · 45 rows shown · 265 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Headband Assembly 7 parts | studio-headphones-headband | 1× | 1 | 9 | assembly |
| 1.1 | Coil Spring | coil-spring | 1× | 1 | · | part |
| 1.2 | Headband Steel Core | studio-headphones-headband-core | 1× | 1 | · | part |
| 1.3 | Headband Memory-Foam Padding | studio-headphones-headband-padding | 1× | 1 | · | part |
| 1.4 | Headband PU Leather Cover | studio-headphones-headband-cover | 1× | 1 | · | part |
| 1.5 | Headband Slider Mechanism | studio-headphones-slider | 2× | 2 | · | part |
| 1.6 | Yoke / Gimbal | studio-headphones-yoke | 2× | 2 | · | part |
| 1.7 | Fastener Set | fastener-set | 1× | 1 | · | part |
| 2 | Ear Cup Assembly 11 parts | studio-headphones-ear-cup | 2× | 2 | 36 | assembly |
| 2.1 | Ear Cup Housing | studio-headphones-cup-housing | 1× | 2 | · | part |
| 2.2 | Dynamic Driver 4 parts | studio-headphones-driver | 1× | 2 | 4 | assembly |
| 2.2.1 | Speaker | speaker | 1× | 2 | · | part |
| 2.2.2 | Neodymium Magnet | neodymium-magnet | 1× | 2 | · | part |
| 2.2.3 | Voice Coil | studio-headphones-voice-coil | 1× | 2 | · | part |
| 2.2.4 | Driver Diaphragm | studio-headphones-diaphragm | 1× | 2 | · | part |
| 2.3 | Driver Baffle | studio-headphones-baffle | 1× | 2 | · | part |
| 2.4 | Acoustic Mesh & Damping | studio-headphones-acoustic-mesh | 2× | 4 | · | part |
| 2.5 | Ear Pad Memory Foam | studio-headphones-ear-pad-foam | 1× | 2 | · | part |
| 2.6 | Ear Pad Cover | studio-headphones-ear-pad-cover | 1× | 2 | · | part |
| 2.7 | Touch Control Panel 2 parts | studio-headphones-touch-panel | 1× | 2 | 21 | assembly |
| 2.7.1 | Bare PCB | pcb-bare | 1× | 2 | · | part |
| 2.7.2 | SMD Passive (R/C/L) | smd-passives | 20× | 40 | · | part |
| 2.8 | ANC Microphone | studio-headphones-anc-mic | 2× | 4 | · | part |
| 2.9 | Call Microphone | studio-headphones-call-mic | 1× | 2 | · | part |
| 2.10 | Wire Bundle | wire-bundle | 1× | 2 | · | part |
| 2.11 | Fastener Set | fastener-set | 1× | 2 | · | part |
| 3 | Mainboard 6 parts | studio-headphones-mainboard | 1× | 1 | 147 | assembly |
| 3.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 3.2 | Bluetooth Audio SoC | studio-headphones-bt-soc | 1× | 1 | · | part |
| 3.3 | ANC DSP | studio-headphones-anc-dsp | 1× | 1 | · | part |
| 3.4 | Microcontroller | mcu | 1× | 1 | · | part |
| 3.5 | SMD Passive (R/C/L) | smd-passives | 140× | 140 | · | part |
| 3.6 | Connector | connector | 3× | 3 | · | part |
| 4 | Battery Pack 3 parts | studio-headphones-battery | 1× | 1 | 3 | assembly |
| 4.1 | LiPo Cell | lipo-cell | 1× | 1 | · | part |
| 4.2 | BMS Board | bms-board | 1× | 1 | · | part |
| 4.3 | Charge IC | studio-headphones-charge-ic | 1× | 1 | · | part |
| 5 | I/O Board 5 parts | studio-headphones-io-board | 1× | 1 | 31 | assembly |
| 5.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 5.2 | Connector | connector | 1× | 1 | · | part |
| 5.3 | 3.5 mm Audio Jack | studio-headphones-aux-jack | 1× | 1 | · | part |
| 5.4 | Tactile Button | studio-headphones-button | 3× | 3 | · | part |
| 5.5 | SMD Passive (R/C/L) | smd-passives | 25× | 25 | · | part |
| 6 | Folding Hinge | studio-headphones-folding-hinge | 2× | 2 | · | part |
| 7 | Carrying Case | carrying-case | 1× | 1 | · | part |
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Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $50–$3k. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
| sennheiser.com ↗ | Wedemark, DE | Headphones & microphones | 1,000 units | 8–12 wks |
| audio-technica.com ↗ | Tokyo, JP | Audio equipment | 1,000 units | 8–12 wks |
| beyerdynamic.com ↗ | Heilbronn, DE | Headphones & microphones | 1,000 units | 8–12 wks |
|
🇯🇵Sony
sony.com ↗
|
Tokyo, JP | Consumer electronics | 1,000 units | 8–12 wks |
|
🇦🇹AKG
akg.com ↗
|
Vienna, AT | Headphones & microphones | 1,000 units | 8–12 wks |
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