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Studio Headphones

Product

Overview

The studio headphones are over-ear, closed-back wireless cans with hybrid active noise cancelling. Each 40 mm dynamic driver is paired with feedforward and feedback microphones, and the set runs wirelessly over Bluetooth or wired over USB-C and 3.5 mm. A folding design and hard-shell case make them portable while retaining a full-size acoustic platform.

Construction

The Headband Assembly carries a sprung steel core under memory-foam padding and a PU cover, with detented sliders for height and gimbal yokes that let each cup swivel to the head. The yokes also locate the Folding Hinge joints that collapse the cups flat for storage in the Carrying Case.

Sound is produced in each Ear Cup Assembly. At its heart the Dynamic Driver combines a voice coil and neodymium magnet motor driving a lightweight diaphragm; acoustic mesh and felt behind the baffle tune the response and damp resonances, while a memory-foam ear pad seals against the head for passive isolation. A capacitive touch panel on the outer face and the ANC Microphone units sit on the same cup.

The Mainboard, housed inside one cup, carries a Bluetooth audio SoC, a dedicated ANC DSP, and a control MCU. The DSP combines the feedforward microphone (sensing noise outside the cup) with the feedback microphone (sensing residual noise at the ear) to generate an anti-noise signal that cancels ambient sound across a wide band.

Power comes from the Battery Pack pack: a LiPo cell with a protection BMS and a USB-C charge controller. The I/O Board exposes the USB-C and 3.5 mm jacks plus the power, pairing, and ANC-mode buttons.

Studio Headphones parts and their functions

7 top-level parts · 265 parts in total · full bill of materials below
Studio Headphones parts diagram: 1 headband assembly, 2 ear cup assembly, 3 mainboard, 4 battery pack, 5 I/O board, 6 folding hinge, 7 carrying case. 265 parts in 7 top-level items.
Studio Headphones parts diagram. Numbers match the table below; each box is one top-level part or assembly with what it contains.
#PartQtyWhat it does
1 Headband Assembly 7 parts 1× Sprung band + padding + sliders
2 Ear Cup Assembly 11 parts 2× Left + right ear cups
3 Mainboard 6 parts 1× BT SoC + ANC DSP, in one cup
4 Battery Pack 3 parts 1× LiPo pack + BMS + charge IC
5 I/O Board 5 parts 1× USB-C + 3.5 mm + buttons
6 Folding Hinge 2× Fold-flat hinges at the yokes
7 Carrying Case 1× Hard-shell travel case

3D model

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Build & assembly graph

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Bill of materials for Studio Headphones

7 top-level lines · 45 rows shown · 265 parts total · indented to 3 levels
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 Headband Assembly 7 parts studio-headphones-headband 1× 1 9 assembly
1.1 Coil Spring coil-spring 1× 1 · part
1.2 Headband Steel Core studio-headphones-headband-core 1× 1 · part
1.3 Headband Memory-Foam Padding studio-headphones-headband-padding 1× 1 · part
1.4 Headband PU Leather Cover studio-headphones-headband-cover 1× 1 · part
1.5 Headband Slider Mechanism studio-headphones-slider 2× 2 · part
1.6 Yoke / Gimbal studio-headphones-yoke 2× 2 · part
1.7 Fastener Set fastener-set 1× 1 · part
2 Ear Cup Assembly 11 parts studio-headphones-ear-cup 2× 2 36 assembly
2.1 Ear Cup Housing studio-headphones-cup-housing 1× 2 · part
2.2 Dynamic Driver 4 parts studio-headphones-driver 1× 2 4 assembly
2.2.1 Speaker speaker 1× 2 · part
2.2.2 Neodymium Magnet neodymium-magnet 1× 2 · part
2.2.3 Voice Coil studio-headphones-voice-coil 1× 2 · part
2.2.4 Driver Diaphragm studio-headphones-diaphragm 1× 2 · part
2.3 Driver Baffle studio-headphones-baffle 1× 2 · part
2.4 Acoustic Mesh & Damping studio-headphones-acoustic-mesh 2× 4 · part
2.5 Ear Pad Memory Foam studio-headphones-ear-pad-foam 1× 2 · part
2.6 Ear Pad Cover studio-headphones-ear-pad-cover 1× 2 · part
2.7 Touch Control Panel 2 parts studio-headphones-touch-panel 1× 2 21 assembly
2.7.1 Bare PCB pcb-bare 1× 2 · part
2.7.2 SMD Passive (R/C/L) smd-passives 20× 40 · part
2.8 ANC Microphone studio-headphones-anc-mic 2× 4 · part
2.9 Call Microphone studio-headphones-call-mic 1× 2 · part
2.10 Wire Bundle wire-bundle 1× 2 · part
2.11 Fastener Set fastener-set 1× 2 · part
3 Mainboard 6 parts studio-headphones-mainboard 1× 1 147 assembly
3.1 Bare PCB pcb-bare 1× 1 · part
3.2 Bluetooth Audio SoC studio-headphones-bt-soc 1× 1 · part
3.3 ANC DSP studio-headphones-anc-dsp 1× 1 · part
3.4 Microcontroller mcu 1× 1 · part
3.5 SMD Passive (R/C/L) smd-passives 140× 140 · part
3.6 Connector connector 3× 3 · part
4 Battery Pack 3 parts studio-headphones-battery 1× 1 3 assembly
4.1 LiPo Cell lipo-cell 1× 1 · part
4.2 BMS Board bms-board 1× 1 · part
4.3 Charge IC studio-headphones-charge-ic 1× 1 · part
5 I/O Board 5 parts studio-headphones-io-board 1× 1 31 assembly
5.1 Bare PCB pcb-bare 1× 1 · part
5.2 Connector connector 1× 1 · part
5.3 3.5 mm Audio Jack studio-headphones-aux-jack 1× 1 · part
5.4 Tactile Button studio-headphones-button 3× 3 · part
5.5 SMD Passive (R/C/L) smd-passives 25× 25 · part
6 Folding Hinge studio-headphones-folding-hinge 2× 2 · part
7 Carrying Case carrying-case 1× 1 · part

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Sourcing: possible vendors

Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $50–$3k. How estimates work
VendorHQSpecialtyMOQLead time
🇩🇪Sennheiser
sennheiser.com ↗
Wedemark, DE Headphones & microphones 1,000 units 8–12 wks
audio-technica.com ↗ Tokyo, JP Audio equipment 1,000 units 8–12 wks
🇩🇪Beyerdynamic
beyerdynamic.com ↗
Heilbronn, DE Headphones & microphones 1,000 units 8–12 wks
🇯🇵Sony
sony.com ↗
Tokyo, JP Consumer electronics 1,000 units 8–12 wks
🇦🇹AKG
akg.com ↗
Vienna, AT Headphones & microphones 1,000 units 8–12 wks

289-word article