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Process I/O Module

Assembly

A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Bill of materials for Process I/O Module

5 top-level lines as of r150747
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 Bare PCB pcb-bare 1× 1 · part
2 Microcontroller mcu 1× 1 · part
3 Relay relay 8× 8 · part
4 Connector connector 16× 16 · part
5 SMD Passive (R/C/L) smd-passives 90× 90 · part