Audio Tour System
AssemblyGPS-triggered multi-language commentary system with a head-end unit, seat-back jacks, and disposable headsets. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Audio Tour System parts and their functions
6 top-level parts · 242 parts in total · full bill of materials below
| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Commentary Head-End Unit 7 parts | 1× | GPS-triggered commentary head-end |
| 2 | Seat Audio Unit 3 parts | 52× | Channel-select seat-back unit |
| 3 | Audio Amplifier 4 parts | 1× | Multi-channel amplifier |
| 4 | Headset | 60× | Multi-channel headsets |
| 5 | PA Speaker | 6× | Driver PA speakers |
| 6 | Wire Bundle | 1× | Audio distribution harness |
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Bill of materials for Audio Tour System
6 top-level lines · 20 rows shown · 242 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Commentary Head-End Unit 7 parts | open-top-tour-bus-commentary-unit | 1× | 1 | 12 | assembly |
| 1.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 1.2 | Microcontroller | mcu | 1× | 1 | · | part |
| 1.3 | SMD Passive (R/C/L) | smd-passives | 1× | 1 | · | part |
| 1.4 | GPS Module | open-top-tour-bus-gps-module | 1× | 1 | · | part |
| 1.5 | Audio Storage | open-top-tour-bus-audio-storage | 1× | 1 | · | part |
| 1.6 | LCD Panel | lcd-panel | 1× | 1 | · | part |
| 1.7 | Connector | connector | 6× | 6 | · | part |
| 2 | Seat Audio Unit 3 parts | open-top-tour-bus-seat-audio-jack | 52× | 52 | 3 | assembly |
| 2.1 | Bare PCB | pcb-bare | 1× | 52 | · | part |
| 2.2 | SMD Passive (R/C/L) | smd-passives | 1× | 52 | · | part |
| 2.3 | Channel Selector | open-top-tour-bus-channel-selector | 1× | 52 | · | part |
| 3 | Audio Amplifier 4 parts | open-top-tour-bus-audio-amplifier | 1× | 1 | 7 | assembly |
| 3.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 3.2 | Power Supply | power-supply | 1× | 1 | · | part |
| 3.3 | SMD Passive (R/C/L) | smd-passives | 1× | 1 | · | part |
| 3.4 | Connector | connector | 4× | 4 | · | part |
| 4 | Headset | open-top-tour-bus-headset | 60× | 60 | · | part |
| 5 | PA Speaker | open-top-tour-bus-pa-speaker | 6× | 6 | · | part |
| 6 | Wire Bundle | wire-bundle | 1× | 1 | · | part |
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Where the audio tour system is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |