Temperature Control
AssemblyClosed-loop PID system holding the die within a few degrees of setpoint, typically 90–160 °C. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Temperature Control
5 top-level lines as of r67579| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | PID Controller | foil-stamping-machine-pid-controller | 1× | 1 | · | part |
| 2 | Solid-State Relay | foil-stamping-machine-ssr | 1× | 1 | · | part |
| 3 | Thermal Fuse | thermal-fuse | 1× | 1 | · | part |
| 4 | Relay | relay | 1× | 1 | · | part |
| 5 | Wire Bundle | wire-bundle | 1× | 1 | · | part |