Bottom Forming Station
AssemblyCreates and seals the cup bottom using heated dies or adhesive lamination. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bottom Forming Station parts and their functions
5 top-level parts · 5 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Bottom Forming Upper Die | 1× | Upper forming die for bottom profile |
| 2 | Bottom Forming Lower Die | 1× | Lower anvil supporting bottom formation |
| 3 | Bottom Formation Motor | 1× | Indexes tube position for bottom forming |
| 4 | Bottom Heater | 1× | Optional heater for seal activation |
| 5 | Bottom Pressure Cylinder | 1× | Pneumatic force pressing dies together |
3D model
No 3D model yet. Have a CAD file of this? Add a 3D model. STL renders right on this page; STEP, FreeCAD, and OpenSCAD sources are welcome too (openly licensed, like all 3D models on BOMwiki).
Build & assembly graph
expand / collapse · shared sub-assemblies converge · links to related products · est. labour
product / assembly
shared across products
atomic part
related product
Tap an assembly to expand/collapse · tap a part to open it · use “Open page” for any node · drag to pan, scroll to zoom.
Bill of materials for Bottom Forming Station
5 top-level lines · 5 rows shown · 5 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Bottom Forming Upper Die | paper-cup-machine-bottom-die-upper | 1× | 1 | · | part |
| 2 | Bottom Forming Lower Die | paper-cup-machine-bottom-die-lower | 1× | 1 | · | part |
| 3 | Bottom Formation Motor | paper-cup-machine-bottom-motor | 1× | 1 | · | part |
| 4 | Bottom Heater | paper-cup-machine-bottom-heater | 1× | 1 | · | part |
| 5 | Bottom Pressure Cylinder | paper-cup-machine-bottom-pressure-cylinder | 1× | 1 | · | part |
Something wrong in this list? Report a problem with this BOM.
Where the bottom forming station is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |