Labelling Head
AssemblyPrints and applies a wrap label with grade, size, and count. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Labelling Head parts and their functions
4 top-level parts · 67 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Thermal Print Engine 4 parts | 1× | Thermal print engine |
| 2 | Tamp Applicator 2 parts | 1× | Tamp-blow applicator |
| 3 | Label Unwind | 1× | Label roll unwind |
| 4 | Bare PCB | 1× | Unpopulated printed circuit board: copper traces etched on an FR-4 glass-epoxy laminate that carry current between the components later soldered to it. |
3D model
No 3D model yet. Have a CAD file of this? Add a 3D model. STL renders right on this page; STEP, FreeCAD, and OpenSCAD sources are welcome too (openly licensed, like all 3D models on BOMwiki).
Build & assembly graph
expand / collapse · shared sub-assemblies converge · links to related products · est. labour
product / assembly
shared across products
atomic part
related product
Tap an assembly to expand/collapse · tap a part to open it · use “Open page” for any node · drag to pan, scroll to zoom.
Bill of materials for Labelling Head
4 top-level lines · 10 rows shown · 67 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Thermal Print Engine 4 parts | ream-wrapping-machine-print-engine | 1× | 1 | 63 | assembly |
| 1.1 | Printhead | ream-wrapping-machine-printhead | 1× | 1 | · | part |
| 1.2 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 1.3 | Microcontroller | mcu | 1× | 1 | · | part |
| 1.4 | SMD Passive (R/C/L) | smd-passives | 60× | 60 | · | part |
| 2 | Tamp Applicator 2 parts | ream-wrapping-machine-applicator | 1× | 1 | 2 | assembly |
| 2.1 | Tamp Pad | ream-wrapping-machine-tamp-pad | 1× | 1 | · | part |
| 2.2 | Pneumatic Cylinder | pneumatic-cylinder | 1× | 1 | · | part |
| 3 | Label Unwind | ream-wrapping-machine-label-unwind | 1× | 1 | · | part |
| 4 | Bare PCB | pcb-bare | 1× | 1 | · | part |
Where the labelling head is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |