Main Board
AssemblySoC-based RIP (raster image processor) running print algorithm. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Main Board
4 top-level lines as of r166248| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 2 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 3 | Microcontroller | mcu | 1× | 1 | · | part |
| 4 | SMD Passive (R/C/L) | smd-passives | 1× | 1 | · | part |