Main Board
AssemblyWiFi SoC with multi-sensor interface and cloud integration. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Main Board
6 top-level lines as of r2313| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 2 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 3 | Microcontroller | mcu | 1× | 1 | · | part |
| 4 | RAM IC | air-quality-monitor-ram | 1× | 1 | · | part |
| 5 | SMD Passive (R/C/L) | smd-passives | 130× | 130 | · | part |
| 6 | Connector | connector | 6× | 6 | · | part |