Main Board
AssemblySoC with Bluetooth, Class-D amplifier, DSP, and passives. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Main Board
8 top-level lines as of r15644| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 2 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 3 | Bluetooth Module | bluetooth-speaker-bt-module | 1× | 1 | · | part |
| 4 | Class-D Amplifier IC | bluetooth-speaker-amp-ic | 1× | 1 | · | part |
| 5 | Audio DSP | bluetooth-speaker-dsp | 1× | 1 | · | part |
| 6 | Charge IC | bluetooth-speaker-charge-ic | 1× | 1 | · | part |
| 7 | SMD Passive (R/C/L) | smd-passives | 140× | 140 | · | part |
| 8 | Connector | connector | 4× | 4 | · | part |