Mainboard
AssemblyApplication SoC with neural accelerator, memory, and Wi-Fi/LTE connectivity for cloud or on-device translation. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Mainboard
8 top-level lines as of r129027| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 2 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 3 | LPDDR4 RAM | pocket-translator-dram | 1× | 1 | · | part |
| 4 | eMMC Storage | pocket-translator-emmc | 1× | 1 | · | part |
| 5 | Wi-Fi / Bluetooth Module | pocket-translator-wifi-bt | 1× | 1 | · | part |
| 6 | LTE Modem | pocket-translator-lte-modem | 1× | 1 | · | part |
| 7 | Power Management IC | pocket-translator-pmic | 1× | 1 | · | part |
| 8 | SMD Passive (R/C/L) | smd-passives | 250× | 250 | · | part |