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Bluetooth LE Module

Assembly

ARM Cortex MCU with integrated BLE 5.1 radio, stack, and on-chip antenna. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Bill of materials for Bluetooth LE Module

4 top-level lines as of r157964
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 Compute SoC Module soc-module 1× 1 · part
2 SoC Bypass Capacitors smart-button-soc-caps 1× 1 · part
3 Antenna Matching Network smart-button-antenna-match 1× 1 · part
4 SMD Passive (R/C/L) smd-passives 20× 20 · part