Smart Assistant SoC Board
AssemblySystem-on-module with main processor, memory, storage, and AI acceleration for voice and vision. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Smart Assistant SoC Board parts and their functions
7 top-level parts · 12 parts in total · full bill of materials below
| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | AI Processor | 1× | Quad-core ARM Cortex-A53, Mali GPU, and dedicated ML accelerator for voice recognition and face detection. |
| 2 | RAM Module | 1× | 3 GB LPDDR4 |
| 3 | Storage Module | 1× | 32 GB eMMC |
| 4 | Wi-Fi Module | 1× | IEEE 802.11ac dual-band radio with integrated antenna. |
| 5 | Bluetooth Module | 1× | Bluetooth 5.0 LE for wireless speaker pairing and accessory control. |
| 6 | Bare PCB | 1× | Unpopulated printed circuit board: copper traces etched on an FR-4 glass-epoxy laminate that carry current between the components later soldered to it. |
| 7 | Connector | 6× | Mating plug-and-socket pair that joins two lengths of wiring or a cable to a board so a circuit can be assembled, serviced, and separated without soldering. |
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Build & assembly graph
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Bill of materials for Smart Assistant SoC Board
7 top-level lines · 7 rows shown · 12 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | AI Processor | smart-display-main-soc | 1× | 1 | · | part |
| 2 | RAM Module | smart-display-ram | 1× | 1 | · | part |
| 3 | Storage Module | smart-display-storage | 1× | 1 | · | part |
| 4 | Wi-Fi Module | smart-display-wifi-module | 1× | 1 | · | part |
| 5 | Bluetooth Module | smart-display-bt-module | 1× | 1 | · | part |
| 6 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 7 | Connector | connector | 6× | 6 | · | part |
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Where the smart assistant SoC board is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.20–$50. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
| powersemi.cc ↗ | Jiaxing, CN | Power semiconductors (IGBT) | 1,000 pcs | 12–20 wks |
|
🇸🇬UTAC
utacgroup.com ↗
|
Singapore | Semiconductor assembly & test | 1,000 pcs | 12–20 wks |
| aseglobal.com ↗ | Singapore | Semiconductor packaging | 1,000 pcs | 12–20 wks |
|
🇨🇳SMIC
smics.com ↗
|
Shanghai, CN | Semiconductor foundry | 1,000 pcs | 12–20 wks |
| spel.com ↗ | Chennai, IN | Semiconductor assembly | 1,000 pcs | 12–20 wks |