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Inner Moulding

Assembly

Epoxy encapsulation that pots the electronics into the shell and forms the smooth skin-contact surface with sensor windows. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Bill of materials for Inner Moulding

3 top-level lines as of r158357
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 Epoxy Potting Fill smart-ring-epoxy-fill 1× 1 · part
2 Optical Sensor Windows smart-ring-sensor-windows 1× 1 · part
3 Sensor Contact Domes smart-ring-sensor-bumps 1× 1 · part