Main Flex Circuit
AssemblyRigid-flex PCB curved around the ring circumference carrying the BLE SoC, memory, and power management. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Main Flex Circuit
6 top-level lines as of r158339| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Rigid-Flex PCB | smart-ring-flex-pcb | 1× | 1 | · | part |
| 2 | BLE SoC | smart-ring-ble-soc | 1× | 1 | · | part |
| 3 | Buffer Flash Memory | smart-ring-flash | 1× | 1 | · | part |
| 4 | Power Management IC | smart-ring-pmic | 1× | 1 | · | part |
| 5 | BLE Antenna | smart-ring-antenna-trace | 1× | 1 | · | part |
| 6 | SMD Passive (R/C/L) | smd-passives | 60× | 60 | · | part |