Mainboard (Logic Board)
AssemblyStacked HDI logic board carrying the SoC, memory, RF, and power management. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Mainboard (Logic Board) parts and their functions
19 top-level parts · 1,328 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Bare PCB | 1× | HDI substrate |
| 2 | Compute SoC Module | 1× | Application processor SoC |
| 3 | LPDDR5 DRAM | 1× | LPDDR5 DRAM (PoP) |
| 4 | UFS Flash Storage | 1× | UFS flash storage |
| 5 | Power Management IC | 1× | Power management IC |
| 6 | RF Transceiver | 1× | RF transceiver |
| 7 | 5G Modem | 1× | 5G baseband modem |
| 8 | RF Power Amplifier Module 1 parts | 3× | Power amplifier front-end modules |
| 9 | WiFi/BT Combo IC | 1× | WiFi/BT combo IC |
| 10 | Audio Codec IC | 1× | Audio codec IC |
| 11 | SMD Passive (R/C/L) | 1300× | Decoupling, bias and termination resistors, capacitors and inductors across the board |
| 12 | Connector | 8× | Board-to-board / FPC connectors |
| 13 | Refined Tin Ingot 1 parts | 1× | ≈1 g SAC305 solder tin across all joints |
| 14 | Capacitor-Grade Tantalum Powder 1 parts | 1× | ≈40 mg in tantalum capacitors |
| 15 | Gold Bond Wire / Plating Stock 1 parts | 1× | ≈30 mg gold in bond wires and plating |
| 16 | Semiconductor Silicon 1 parts | 1× | ≈0.5 g of finished silicon die across all chips |
| 17 | Refined Silver | 1× | ≈300 mg in pastes, contacts, and MLCC terminations |
| 18 | Palladium Sponge | 1× | ≈10 mg in MLCC inner electrodes |
| 19 | Synthetic Quartz Crystal | 2× | Timing crystals (32 kHz + MHz) |
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Bill of materials for Mainboard (Logic Board)
19 top-level lines · 26 rows shown · 1,328 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 2 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 3 | LPDDR5 DRAM | smartphone-ram-lpddr | 1× | 1 | · | part |
| 4 | UFS Flash Storage | smartphone-ufs-storage | 1× | 1 | · | part |
| 5 | Power Management IC | smartphone-pmic | 1× | 1 | · | part |
| 6 | RF Transceiver | smartphone-rf-transceiver | 1× | 1 | · | part |
| 7 | 5G Modem | smartphone-5g-modem | 1× | 1 | · | part |
| 8 | RF Power Amplifier Module 1 parts | smartphone-pa-module | 3× | 3 | 1 | assembly |
| 8.1 | Gallium Metal 1 parts | gallium-metal | 1× | 3 | 1 | assembly |
| 8.1.1 | Bauxite Ore | bauxite-ore | 1× | 3 | · | part |
| 9 | WiFi/BT Combo IC | smartphone-wifi-bt-combo | 1× | 1 | · | part |
| 10 | Audio Codec IC | smartphone-audio-codec | 1× | 1 | · | part |
| 11 | SMD Passive (R/C/L) | smd-passives | 1300× | 1,300 | · | part |
| 12 | Connector | connector | 8× | 8 | · | part |
| 13 | Refined Tin Ingot 1 parts | tin-ingot | 1× | 1 | 1 | assembly |
| 13.1 | Cassiterite Concentrate | cassiterite-concentrate | 1× | 1 | · | part |
| 14 | Capacitor-Grade Tantalum Powder 1 parts | tantalum-powder | 1× | 1 | 1 | assembly |
| 14.1 | Coltan Concentrate | coltan-concentrate | 1× | 1 | · | part |
| 15 | Gold Bond Wire / Plating Stock 1 parts | gold-bond-wire | 1× | 1 | 1 | assembly |
| 15.1 | Gold Ore / Doré | gold-ore-concentrate | 1× | 1 | · | part |
| 16 | Semiconductor Silicon 1 parts | silicon-wafer-stock | 1× | 1 | 1 | assembly |
| 16.1 | Polysilicon 1 parts | polysilicon | 1× | 1 | 1 | assembly |
| 16.1.1 | Metallurgical-Grade Silicon 1 parts + deeper › | metallurgical-silicon | 1× | 1 | 1 | assembly |
| 17 | Refined Silver | refined-silver | 1× | 1 | · | part |
| 18 | Palladium Sponge | palladium-sponge | 1× | 1 | · | part |
| 19 | Synthetic Quartz Crystal | synthetic-quartz-crystal | 2× | 2 | · | part |
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Where the mainboard (logic board) is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $1–$200. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳JLCPCB
jlcpcb.com ↗
|
Shenzhen, CN | PCB fabrication | 100 pcs | 2–4 wks |
|
🇨🇳PCBWay
pcbway.com ↗
|
Shenzhen, CN | PCB fab & assembly | 100 pcs | 2–4 wks |
| scc.com.cn ↗ | Shenzhen, CN | PCB manufacturer | 100 pcs | 2–4 wks |
| shogini.com ↗ | Mumbai, IN | PCB manufacturer | 100 pcs | 2–4 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 100 pcs | 2–4 wks |