Gold Bond Wire / Plating Stock
AssemblyFine gold for wire bonding and contact plating; a phone carries roughly 30 mg. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Gold Bond Wire / Plating Stock
1 top-level line as of r103603| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Gold Ore / Doré | gold-ore-concentrate | 1× | 1 | · | part |