Mainboard (Logic Board)
AssemblyStacked HDI logic board carrying the SoC, memory, RF, and power management. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Mainboard (Logic Board)
19 top-level lines as of r158466| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 2 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 3 | LPDDR5 DRAM | smartphone-ram-lpddr | 1× | 1 | · | part |
| 4 | UFS Flash Storage | smartphone-ufs-storage | 1× | 1 | · | part |
| 5 | Power Management IC | smartphone-pmic | 1× | 1 | · | part |
| 6 | RF Transceiver | smartphone-rf-transceiver | 1× | 1 | · | part |
| 7 | 5G Modem | smartphone-5g-modem | 1× | 1 | · | part |
| 8 | RF Power Amplifier Module 1 parts | smartphone-pa-module | 3× | 3 | 0 | assembly |
| 9 | WiFi/BT Combo IC | smartphone-wifi-bt-combo | 1× | 1 | · | part |
| 10 | Audio Codec IC | smartphone-audio-codec | 1× | 1 | · | part |
| 11 | SMD Passive (R/C/L) | smd-passives | 1300× | 1,300 | · | part |
| 12 | Connector | connector | 8× | 8 | · | part |
| 13 | Refined Tin Ingot 1 parts | tin-ingot | 1× | 1 | 0 | assembly |
| 14 | Capacitor-Grade Tantalum Powder 1 parts | tantalum-powder | 1× | 1 | 0 | assembly |
| 15 | Gold Bond Wire / Plating Stock 1 parts | gold-bond-wire | 1× | 1 | 0 | assembly |
| 16 | Semiconductor Silicon 1 parts | silicon-wafer-stock | 1× | 1 | 0 | assembly |
| 17 | Refined Silver | refined-silver | 1× | 1 | · | part |
| 18 | Palladium Sponge | palladium-sponge | 1× | 1 | · | part |
| 19 | Synthetic Quartz Crystal | synthetic-quartz-crystal | 2× | 2 | · | part |