Thermal Management
AssemblyHeat sink and vapor-chamber coupling rejecting TEC waste heat to the environment. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Thermal Management
3 top-level lines as of r7311| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Heat Sink | astrophotography-ccd-camera-heat-sink | 1× | 1 | · | part |
| 2 | Thermal Interface Material | astrophotography-ccd-camera-thermal-paste | 1× | 1 | · | part |
| 3 | Fan and Shroud | astrophotography-ccd-camera-fan-shroud | 1× | 1 | · | part |