Thermal Imaging Camera
ProductOverview
A thermal imaging camera makes heat visible. Every object above absolute zero emits long-wave infrared radiation, and the amount it emits rises sharply with temperature; this camera focuses that radiation onto an uncooled microbolometer array, reads the tiny temperature change at each pixel, and renders the scene as a false-colour map of surface temperature. It sees through total darkness, smoke, and glare, which makes it a working tool for electricians, building inspectors, firefighters, and mechanics who need to find hot connections, missing insulation, or trapped heat.
How it works
Infrared cannot pass through ordinary glass, so the Germanium Lens Assembly uses germanium elements with an anti-reflection coating, the standard optical material transparent in the 8–14 µm band. It focuses scene radiation onto the Microbolometer Detector, an uncooled focal-plane array of microbolometers whose pixels each change resistance as they absorb IR; a readout IC, a thermoelectric stabiliser, and a periodic NUC shutter flag keep the array calibrated against drift.
The Sensor Front-End Board interfaces the detector and digitises its low-level analogue signal through a high-resolution ADC. From there the Main Processor Board image-processor SoC applies non-uniformity correction, maps temperature to a colour palette, and composites the result for the Display Module colour touchscreen. To make warm objects easier to identify, a separate Visible-Light Camera CMOS camera captures the scene in visible light, and the processor fuses its edge detail with the thermal image.
The optics and electronics sit in a sealed Housing Assembly with an overmoulded grip and weather seal, sized for one-handed use. A Battery Pack LiPo pack powers the unit, a laser pointer marks the measured spot, and a trigger captures radiometric images to microSD, each frame storing a full temperature value per pixel for later analysis.
Thermal Imaging Camera parts and their functions
14 top-level parts · 389 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Housing Assembly 6 parts | 1× | Sealed handheld body and grip |
| 2 | Germanium Lens Assembly 4 parts | 1× | Germanium IR objective |
| 3 | Microbolometer Detector 6 parts | 1× | Microbolometer FPA detector |
| 4 | Sensor Front-End Board 5 parts | 1× | Sensor interface / ADC board |
| 5 | Main Processor Board 7 parts | 1× | Image processor mainboard |
| 6 | Display Module 3 parts | 1× | Colour LCD touchscreen |
| 7 | Visible-Light Camera 3 parts | 1× | Visible-light fusion camera |
| 8 | Laser Pointer Module 2 parts | 1× | Class 2 laser pointer |
| 9 | Trigger & Button Cluster 4 parts | 1× | Trigger and button cluster |
| 10 | Battery Pack 3 parts | 1× | Rechargeable LiPo pack |
| 11 | Charge / Data Port 2 parts | 1× | USB-C charge / data port |
| 12 | microSD Slot | 1× | microSD storage slot |
| 13 | Internal Wiring Harness 2 parts | 1× | Internal harness and connectors |
| 14 | Fastener Set | 1× | Body and bracket fasteners |
3D model
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Build & assembly graph
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Bill of materials for Thermal Imaging Camera
14 top-level lines · 64 rows shown · 389 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Housing Assembly 6 parts | thermal-camera-housing | 1× | 1 | 6 | assembly |
| 1.1 | Front Body Shell | thermal-camera-front-shell | 1× | 1 | · | part |
| 1.2 | Rear Body Shell | thermal-camera-rear-shell | 1× | 1 | · | part |
| 1.3 | Rubber Armour Overmould | thermal-camera-rubber-overmould | 1× | 1 | · | part |
| 1.4 | Hand Grip | thermal-camera-grip | 1× | 1 | · | part |
| 1.5 | O-Ring Set | oring-set | 1× | 1 | · | part |
| 1.6 | Fastener Set | fastener-set | 1× | 1 | · | part |
| 2 | Germanium Lens Assembly 4 parts | thermal-camera-lens-assembly | 1× | 1 | 7 | assembly |
| 2.1 | Germanium Lens Element | thermal-camera-ge-lens-element | 2× | 2 | · | part |
| 2.2 | AR-Coated Ge Window | thermal-camera-ar-coating-window | 1× | 1 | · | part |
| 2.3 | Lens Barrel | thermal-camera-lens-barrel | 1× | 1 | · | part |
| 2.4 | Focus Mechanism 3 parts | thermal-camera-focus-mechanism | 1× | 1 | 3 | assembly |
| 2.4.1 | Focus Stepper Motor | thermal-camera-focus-motor | 1× | 1 | · | part |
| 2.4.2 | Focus Cam Barrel | thermal-camera-focus-cam | 1× | 1 | · | part |
| 2.4.3 | Focus Control Ring | thermal-camera-focus-ring | 1× | 1 | · | part |
| 3 | Microbolometer Detector 6 parts | thermal-camera-detector | 1× | 1 | 6 | assembly |
| 3.1 | Microbolometer FPA Array | thermal-camera-fpa-array | 1× | 1 | · | part |
| 3.2 | ROIC | thermal-camera-roic | 1× | 1 | · | part |
| 3.3 | Thermoelectric Cooler (TEC) | thermal-camera-tec | 1× | 1 | · | part |
| 3.4 | NUC Shutter Flag | thermal-camera-shutter-flag | 1× | 1 | · | part |
| 3.5 | Shutter Flag Motor | thermal-camera-flag-motor | 1× | 1 | · | part |
| 3.6 | Detector Package Housing | thermal-camera-detector-housing | 1× | 1 | · | part |
| 4 | Sensor Front-End Board 5 parts | thermal-camera-front-end-board | 1× | 1 | 95 | assembly |
| 4.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 4.2 | Detector Interface IC | thermal-camera-sensor-interface | 1× | 1 | · | part |
| 4.3 | Analog-to-Digital Converter | thermal-camera-adc | 1× | 1 | · | part |
| 4.4 | SMD Passive (R/C/L) | smd-passives | 90× | 90 | · | part |
| 4.5 | Connector | connector | 2× | 2 | · | part |
| 5 | Main Processor Board 7 parts | thermal-camera-main-board | 1× | 1 | 231 | assembly |
| 5.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 5.2 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 5.3 | Microcontroller | mcu | 1× | 1 | · | part |
| 5.4 | DDR RAM IC | thermal-camera-ram | 1× | 1 | · | part |
| 5.5 | NAND Flash IC | thermal-camera-flash | 1× | 1 | · | part |
| 5.6 | SMD Passive (R/C/L) | smd-passives | 220× | 220 | · | part |
| 5.7 | Connector | connector | 6× | 6 | · | part |
| 6 | Display Module 3 parts | thermal-camera-display | 1× | 1 | 3 | assembly |
| 6.1 | LCD Panel | lcd-panel | 1× | 1 | · | part |
| 6.2 | Touch Digitizer | touch-digitizer | 1× | 1 | · | part |
| 6.3 | Display Bezel | thermal-camera-display-bezel | 1× | 1 | · | part |
| 7 | Visible-Light Camera 3 parts | thermal-camera-visible-cam | 1× | 1 | 3 | assembly |
| 7.1 | CMOS Image Sensor | thermal-camera-cmos-sensor | 1× | 1 | · | part |
| 7.2 | Visible Camera Lens | thermal-camera-vis-lens | 1× | 1 | · | part |
| 7.3 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 8 | Laser Pointer Module 2 parts | thermal-camera-laser-pointer | 1× | 1 | 2 | assembly |
| 8.1 | Laser Diode | thermal-camera-laser-diode | 1× | 1 | · | part |
| 8.2 | Laser Collimator Optics | thermal-camera-laser-optics | 1× | 1 | · | part |
| 9 | Trigger & Button Cluster 4 parts | thermal-camera-trigger-buttons | 1× | 1 | 23 | assembly |
| 9.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 9.2 | Capture Trigger | thermal-camera-trigger | 1× | 1 | · | part |
| 9.3 | Navigation Button Set | thermal-camera-button-set | 1× | 1 | · | part |
| 9.4 | SMD Passive (R/C/L) | smd-passives | 20× | 20 | · | part |
| 10 | Battery Pack 3 parts | thermal-camera-battery | 1× | 1 | 3 | assembly |
| 10.1 | LiPo Cell | lipo-cell | 1× | 1 | · | part |
| 10.2 | BMS Board | bms-board | 1× | 1 | · | part |
| 10.3 | Battery Door | thermal-camera-battery-door | 1× | 1 | · | part |
| 11 | Charge / Data Port 2 parts | thermal-camera-charge-port | 1× | 1 | 2 | assembly |
| 11.1 | Connector | connector | 1× | 1 | · | part |
| 11.2 | Port Sealing Flap | thermal-camera-port-flap | 1× | 1 | · | part |
| 12 | microSD Slot | thermal-camera-microsd-slot | 1× | 1 | · | part |
| 13 | Internal Wiring Harness 2 parts | thermal-camera-wiring | 1× | 1 | 6 | assembly |
| 13.1 | Wire Bundle | wire-bundle | 1× | 1 | · | part |
| 13.2 | Connector | connector | 5× | 5 | · | part |
| 14 | Fastener Set | fastener-set | 1× | 1 | · | part |
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Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $100–$8k. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇯🇵Canon
canon.com ↗
|
Tokyo, JP | Imaging & optics | 500 units | 10–16 wks |
|
🇯🇵Nikon
nikon.com ↗
|
Tokyo, JP | Imaging & optics | 500 units | 10–16 wks |
|
🇩🇪ZEISS
zeiss.com ↗
|
Oberkochen, DE | Optics & optoelectronics | 500 units | 10–16 wks |
| leica-camera.com ↗ | Wetzlar, DE | Cameras & optics | 500 units | 10–16 wks |
| flir.com ↗ | Wilsonville, US | Thermal imaging | 500 units | 10–16 wks |
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