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Memory System

Assembly

Ring buffer with DRAM and circular write logic for continuous frame capture. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Bill of materials for Memory System

3 top-level lines as of r82199
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 DRAM Buffer Module high-speed-camera-dram-module 1× 1 · part
2 Memory Controller IC high-speed-camera-memory-controller 1× 1 · part
3 Bare PCB pcb-bare 1× 1 · part