Thermal Management
AssemblyConductive paths that move 3–6 W from sensor and FPGA into the housing, since dark current doubles roughly every 6–8 °C. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Thermal Management
3 top-level lines as of r101344| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Thermal Gap Pad | machine-vision-camera-thermal-pad | 2× | 2 | · | part |
| 2 | Heat Spreader Plate | machine-vision-camera-heat-spreader | 1× | 1 | · | part |
| 3 | Temperature Sensor | machine-vision-camera-temp-sensor | 1× | 1 | · | part |