Beamformer & Processing
AssemblyFront-end analog, beamformer, and back-end image-processing boards plus Doppler audio. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Beamformer & Processing parts and their functions
5 top-level parts · 961 parts in total · full bill of materials below
| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Analog Front-End Board 4 parts | 1× | Analog front-end |
| 2 | Beamformer Board 4 parts | 1× | Beamformer ASIC |
| 3 | Back-End Processing Board 4 parts | 1× | Back-end processor |
| 4 | Image Processing Board 3 parts | 1× | Image processing |
| 5 | Speaker | 1× | Doppler audio |
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Bill of materials for Beamformer & Processing
5 top-level lines · 20 rows shown · 961 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Analog Front-End Board 4 parts | ultrasound-machine-frontend-board | 1× | 1 | 411 | assembly |
| 1.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 1.2 | Ultrasound AFE IC | ultrasound-machine-afe-ic | 4× | 4 | · | part |
| 1.3 | SMD Passive (R/C/L) | smd-passives | 400× | 400 | · | part |
| 1.4 | Connector | connector | 6× | 6 | · | part |
| 2 | Beamformer Board 4 parts | ultrasound-machine-beamformer-board | 1× | 1 | 206 | assembly |
| 2.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 2.2 | Beamformer ASIC | ultrasound-machine-beamformer-asic | 1× | 1 | · | part |
| 2.3 | SMD Passive (R/C/L) | smd-passives | 200× | 200 | · | part |
| 2.4 | Connector | connector | 4× | 4 | · | part |
| 3 | Back-End Processing Board 4 parts | ultrasound-machine-backend-board | 1× | 1 | 188 | assembly |
| 3.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 3.2 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 3.3 | SMD Passive (R/C/L) | smd-passives | 180× | 180 | · | part |
| 3.4 | Connector | connector | 6× | 6 | · | part |
| 4 | Image Processing Board 3 parts | ultrasound-machine-image-board | 1× | 1 | 155 | assembly |
| 4.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 4.2 | SMD Passive (R/C/L) | smd-passives | 150× | 150 | · | part |
| 4.3 | Connector | connector | 4× | 4 | · | part |
| 5 | Speaker | speaker | 1× | 1 | · | part |
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Where the beamformer & processing is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |