NIBP Module
AssemblyNon-invasive blood-pressure module: a pump inflates the cuff, a valve bleeds it down, and a pressure sensor reads the oscillations that mark systolic and diastolic pressure. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
NIBP Module parts and their functions
5 top-level parts · 90 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Cuff Pump 4 parts | 1× | Cuff inflation pump |
| 2 | Deflation Valve 2 parts | 1× | Deflation valve |
| 3 | Pressure Sensor | 1× | Cuff pressure sensor |
| 4 | NIBP Board 3 parts | 1× | NIBP control board |
| 5 | Arm Cuff | 1× | Arm cuff + hose |
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Bill of materials for NIBP Module
5 top-level lines · 21 rows shown · 90 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Cuff Pump 4 parts | vsm-nibp-pump | 1× | 1 | 24 | assembly |
| 1.1 | Stator Assembly 3 parts | stator-assembly | 1× | 1 | 3 | assembly |
| 1.1.1 | Stator Core (laminations) | stator-core | 1× | 1 | · | part |
| 1.1.2 | Copper Winding | copper-winding | 1× | 1 | · | part |
| 1.1.3 | Slot Insulation | stator-insulation | 1× | 1 | · | part |
| 1.2 | Rotor Assembly 4 parts | rotor-assembly | 1× | 1 | 19 | assembly |
| 1.2.1 | Rotor Shaft | rotor-shaft | 1× | 1 | · | part |
| 1.2.2 | Rotor Core | rotor-core | 1× | 1 | · | part |
| 1.2.3 | Neodymium Magnet | neodymium-magnet | 16× | 16 | · | part |
| 1.2.4 | Ball Bearing | ball-bearing | 1× | 1 | · | part |
| 1.3 | Pump Diaphragm | vsm-pump-diaphragm | 1× | 1 | · | part |
| 1.4 | Motor Housing | motor-housing | 1× | 1 | · | part |
| 2 | Deflation Valve 2 parts | vsm-nibp-valve | 1× | 1 | 2 | assembly |
| 2.1 | Relay | relay | 1× | 1 | · | part |
| 2.2 | Valve Orifice | vsm-valve-orifice | 1× | 1 | · | part |
| 3 | Pressure Sensor | pressure-sensor | 1× | 1 | · | part |
| 4 | NIBP Board 3 parts | vsm-nibp-board | 1× | 1 | 62 | assembly |
| 4.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 4.2 | Microcontroller | mcu | 1× | 1 | · | part |
| 4.3 | SMD Passive (R/C/L) | smd-passives | 60× | 60 | · | part |
| 5 | Arm Cuff | vsm-nibp-cuff | 1× | 1 | · | part |
Where the NIBP module is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |