Heatsink and Thermal Path
AssemblyAluminum extrusion and thermal interface dissipating processor and driver losses. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Heatsink and Thermal Path
3 top-level lines as of r59299| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Extruded Heatsink | ev-load-controller-heatsink | 1× | 1 | · | part |
| 2 | Thermal Interface Material | ev-load-controller-thermal-compound | 1× | 1 | · | part |
| 3 | Fastener Set | fastener-set | 1× | 1 | · | part |