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Discussion History

Instrumentation Package

Assembly

Pressure and temperature sensing with local readout and signal output. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Instrumentation Package parts and their functions

7 top-level parts · 76 parts in total · full bill of materials below
Instrumentation Package parts diagram: 1 pressure sensor, 2 RTD temperature probe, 3 bourdon pressure gauge, 4 orifice plate, 5 multivariable transmitter, 6 connector, 7 wire bundle. 76 parts in 7 top-level items.
Instrumentation Package parts diagram. Numbers match the table below; each box is one top-level part or assembly with what it contains.
#PartQtyWhat it does
1 Pressure Sensor 2× Wellhead and flow-line pressure
2 RTD Temperature Probe 2× Steam/brine temperature
3 Bourdon Pressure Gauge 2× Local bourdon gauges
4 Orifice Plate 1× Differential-pressure flow element
5 Multivariable Transmitter 5 parts 1× Multivariable transmitter
6 Connector 4× Mating plug-and-socket pair that joins two lengths of wiring or a cable to a board so a circuit can be assembled, serviced, and separated without soldering.
7 Wire Bundle 1× Group of insulated conductors cut to length, terminated, and bound together to carry power and signals between the assemblies of a machine.

3D model

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Build & assembly graph

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Bill of materials for Instrumentation Package

7 top-level lines · 12 rows shown · 76 parts total · indented to 3 levels
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 Pressure Sensor pressure-sensor 2× 2 · part
2 RTD Temperature Probe geothermal-wellhead-rtd-probe 2× 2 · part
3 Bourdon Pressure Gauge geothermal-wellhead-pressure-gauge 2× 2 · part
4 Orifice Plate geothermal-wellhead-orifice-plate 1× 1 · part
5 Multivariable Transmitter 5 parts geothermal-wellhead-transmitter 1× 1 64 assembly
5.1 Bare PCB pcb-bare 1× 1 · part
5.2 Microcontroller mcu 1× 1 · part
5.3 Pressure Sensor pressure-sensor 1× 1 · part
5.4 SMD Passive (R/C/L) smd-passives 60× 60 · part
5.5 Connector connector 1× 1 · part
6 Connector connector 4× 4 · part
7 Wire Bundle wire-bundle 1× 1 · part

Where the instrumentation package is used

1 product across 1 domain contain it, directly or inside a sub-assembly

Used in 1 assembly

Geothermal Wellhead

Sourcing: possible vendors

Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work
VendorHQSpecialtyMOQLead time
🇨🇳Foxconn
foxconn.com ↗ 		Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
🇸🇬Flex (Singapore)
flex.com ↗ 		Singapore Electronics contract mfg 1,000 pcs 6–10 wks
🇮🇳Dixon Technologies
dixoninfo.com ↗ 		Noida, IN Electronics contract mfg 1,000 pcs 6–10 wks
🇨🇳BYD Electronics
bydelectronic.com ↗ 		Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
🇸🇬Venture Corp
venture.com.sg ↗ 		Singapore Electronics contract mfg 1,000 pcs 6–10 wks