Instrumentation and Controls
AssemblyDistributed control interface, sensors, and actuators coordinating the HRSG within the combined cycle. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Instrumentation and Controls parts and their functions
12 top-level parts · 82 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Control Cabinet | 1× | Control and marshalling cabinet |
| 2 | Pressure Sensor | 9× | Pressure transmitters on drums and steam lines |
| 3 | Thermocouple | 18× | Thermocouples on tube banks and steam outlets |
| 4 | Flow Transmitter | 6× | Feedwater and steam flow transmitters |
| 5 | Valve Actuator | 8× | Electric and pneumatic valve actuators |
| 6 | Bare PCB | 4× | Controller and I/O boards |
| 7 | Microcontroller | 4× | Microcontrollers on I/O modules |
| 8 | SMD Passive (R/C/L) | 4× | Passive components on the boards |
| 9 | Connector | 12× | Field wiring connectors |
| 10 | Wire Bundle | 6× | Instrument and power cabling |
| 11 | Power Supply | 2× | Redundant 24 V control power supplies |
| 12 | Relay | 8× | Interposing and trip relays |
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Bill of materials for Instrumentation and Controls
12 top-level lines · 12 rows shown · 82 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Control Cabinet | heat-recovery-steam-generator-control-cabinet | 1× | 1 | · | part |
| 2 | Pressure Sensor | pressure-sensor | 9× | 9 | · | part |
| 3 | Thermocouple | heat-recovery-steam-generator-thermocouple | 18× | 18 | · | part |
| 4 | Flow Transmitter | heat-recovery-steam-generator-flow-transmitter | 6× | 6 | · | part |
| 5 | Valve Actuator | heat-recovery-steam-generator-valve-actuator | 8× | 8 | · | part |
| 6 | Bare PCB | pcb-bare | 4× | 4 | · | part |
| 7 | Microcontroller | mcu | 4× | 4 | · | part |
| 8 | SMD Passive (R/C/L) | smd-passives | 4× | 4 | · | part |
| 9 | Connector | connector | 12× | 12 | · | part |
| 10 | Wire Bundle | wire-bundle | 6× | 6 | · | part |
| 11 | Power Supply | power-supply | 2× | 2 | · | part |
| 12 | Relay | relay | 8× | 8 | · | part |
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Where the instrumentation and controls is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |