Potting Compound
PartThermally conductive epoxy, 1–2 W/m·K, filling module for thermal coupling. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Thermally conductive epoxy, 1–2 W/m·K, filling module for thermal coupling. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.