Thermal Adhesive Pad
PartPressure-sensitive thermal pad, 3–5 W/m·K, coupling module to panel back-sheet. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Pressure-sensitive thermal pad, 3–5 W/m·K, coupling module to panel back-sheet. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.