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Grounding and Bonding

Assembly

Copper rod arrays and bonding straps creating low-impedance ground path for safety and transient suppression. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Bill of materials for Grounding and Bonding

3 top-level lines as of r109772
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 Copper-Bonded Grounding Rod mobile-substation-ground-rods 8× 8 · part
2 Main Ground Bus Bar mobile-substation-ground-bus 1× 1 · part
3 Bonding Cable mobile-substation-bonding-straps 6× 6 · part