Encapsulation Epoxy
PartThermally conductive potting, 1–2 W/m·K, filling J-box cavities. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Thermally conductive potting, 1–2 W/m·K, filling J-box cavities. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.