Thermal Interface Material
PartSilicone-based interface pad, 2–3 W/m·K conductivity, 0.5 mm thickness. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Silicone-based interface pad, 2–3 W/m·K conductivity, 0.5 mm thickness. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.