I/O Subsystem
AssemblyRack of process I/O modules converting field signals to and from the controller, with hot-swap modules and field termination. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
I/O Subsystem parts and their functions
8 top-level parts · 751 parts in total · full bill of materials below
| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | I/O Backplane 3 parts | 1× | I/O carrier backplane with module slots |
| 2 | Analog Input Module 6 parts | 4× | Analog input modules, 16 channels each |
| 3 | Analog Output Module 6 parts | 2× | Analog output modules, 8 channels each |
| 4 | Digital Input Module 5 parts | 4× | Digital input modules, 32 channels each |
| 5 | Digital Output Module 6 parts | 4× | Digital output modules, 16 channels each |
| 6 | RTD / Thermocouple Module 6 parts | 2× | RTD and thermocouple input modules, 8 channels each |
| 7 | Field Termination Assembly 3 parts | 8× | Pluggable field termination assemblies, one per module |
| 8 | Fastener Set | 1× | Module retention and grounding hardware |
3D model
No 3D model yet. Have a CAD file of this? Add a 3D model. STL renders right on this page; STEP, FreeCAD, and OpenSCAD sources are welcome too (openly licensed, like all 3D models on BOMwiki).
Build & assembly graph
expand / collapse · shared sub-assemblies converge · links to related products · est. labour
product / assembly
shared across products
atomic part
related product
Tap an assembly to expand/collapse · tap a part to open it · use “Open page” for any node · drag to pan, scroll to zoom.
Bill of materials for I/O Subsystem
8 top-level lines · 43 rows shown · 751 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | I/O Backplane 3 parts | power-plant-control-room-io-backplane | 1× | 1 | 18 | assembly |
| 1.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 1.2 | Connector | connector | 16× | 16 | · | part |
| 1.3 | SMD Passive (R/C/L) | smd-passives | 1× | 1 | · | part |
| 2 | Analog Input Module 6 parts | power-plant-control-room-ai-module | 4× | 4 | 22 | assembly |
| 2.1 | Bare PCB | pcb-bare | 1× | 4 | · | part |
| 2.2 | Microcontroller | mcu | 1× | 4 | · | part |
| 2.3 | Analog-to-Digital Converter | power-plant-control-room-adc | 2× | 8 | · | part |
| 2.4 | Signal Isolator | power-plant-control-room-signal-isolator | 16× | 64 | · | part |
| 2.5 | SMD Passive (R/C/L) | smd-passives | 1× | 4 | · | part |
| 2.6 | Connector | connector | 1× | 4 | · | part |
| 3 | Analog Output Module 6 parts | power-plant-control-room-ao-module | 2× | 2 | 20 | assembly |
| 3.1 | Bare PCB | pcb-bare | 1× | 2 | · | part |
| 3.2 | Microcontroller | mcu | 1× | 2 | · | part |
| 3.3 | Digital-to-Analog Converter | power-plant-control-room-dac | 8× | 16 | · | part |
| 3.4 | Signal Isolator | power-plant-control-room-signal-isolator | 8× | 16 | · | part |
| 3.5 | SMD Passive (R/C/L) | smd-passives | 1× | 2 | · | part |
| 3.6 | Connector | connector | 1× | 2 | · | part |
| 4 | Digital Input Module 5 parts | power-plant-control-room-di-module | 4× | 4 | 36 | assembly |
| 4.1 | Bare PCB | pcb-bare | 1× | 4 | · | part |
| 4.2 | Microcontroller | mcu | 1× | 4 | · | part |
| 4.3 | Optocoupler | power-plant-control-room-optocoupler | 32× | 128 | · | part |
| 4.4 | SMD Passive (R/C/L) | smd-passives | 1× | 4 | · | part |
| 4.5 | Connector | connector | 1× | 4 | · | part |
| 5 | Digital Output Module 6 parts | power-plant-control-room-do-module | 4× | 4 | 36 | assembly |
| 5.1 | Bare PCB | pcb-bare | 1× | 4 | · | part |
| 5.2 | Microcontroller | mcu | 1× | 4 | · | part |
| 5.3 | Optocoupler | power-plant-control-room-optocoupler | 16× | 64 | · | part |
| 5.4 | Solid-State Output Driver | power-plant-control-room-output-fet | 16× | 64 | · | part |
| 5.5 | SMD Passive (R/C/L) | smd-passives | 1× | 4 | · | part |
| 5.6 | Connector | connector | 1× | 4 | · | part |
| 6 | RTD / Thermocouple Module 6 parts | power-plant-control-room-rtd-module | 2× | 2 | 6 | assembly |
| 6.1 | Bare PCB | pcb-bare | 1× | 2 | · | part |
| 6.2 | Microcontroller | mcu | 1× | 2 | · | part |
| 6.3 | Analog-to-Digital Converter | power-plant-control-room-adc | 1× | 2 | · | part |
| 6.4 | Cold-Junction Sensor | power-plant-control-room-cjc-sensor | 1× | 2 | · | part |
| 6.5 | SMD Passive (R/C/L) | smd-passives | 1× | 2 | · | part |
| 6.6 | Connector | connector | 1× | 2 | · | part |
| 7 | Field Termination Assembly 3 parts | power-plant-control-room-io-termination | 8× | 8 | 38 | assembly |
| 7.1 | Terminal Block | power-plant-control-room-terminal-block | 36× | 288 | · | part |
| 7.2 | Connector | connector | 1× | 8 | · | part |
| 7.3 | DIN Rail | power-plant-control-room-din-rail | 1× | 8 | · | part |
| 8 | Fastener Set | fastener-set | 1× | 1 | · | part |
Something wrong in this list? Report a problem with this BOM.
Where the I/O subsystem is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |