BOMwiki the bill-of-materials encyclopedia
30,443,794 parts mapped · 193,030 items

This page is machine-generated and unverified (what this means). Treat details as provisional. If you know this hardware, weigh in or correct it directly with Edit.

Discussion History

Powder Preparation and Shaping

Assembly

Precursor powders are weighed on the analytical balance, ground in an agate mortar or the planetary mill and pressed into pellets in a die under the hydraulic press. After firing, the diamond saw and silicon carbide paper shape pellets into flat bars, and the caliper gives the dimensions for resistivity. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Powder Preparation and Shaping parts and their functions

16 top-level parts · 78 parts in total · full bill of materials below
Powder Preparation and Shaping parts diagram: 1 analytical balance, 2 weighing paper, 3 micro spatulas, 4 agate mortar and pestle, 5 planetary ball mill, 6 milling jars, 7 milling media, 8 test sieves, 9 hydraulic pellet press, 10 pellet die sets, 11 low-speed diamond saw, 12 diamond wafering blade, 13 mounting wax, 14 saw cutting fluid, 15 silicon carbide abrasive paper, 16 digital caliper. 78 parts in 16 top-level items.
Powder Preparation and Shaping parts diagram. Numbers match the table below; each box is one top-level part or assembly with what it contains.
#PartQtyWhat it does
1 Analytical Balance 12 parts 1× Weighs precursor powders to the stoichiometric ratio of the target compound. Core
2 Weighing Paper 2× Holds each powder charge on the balance pan and lets it slide into the mortar without loss. Core, pack of 500
3 Micro Spatulas 2× Transfers powder between bottle, weighing paper, mortar and die. Core, pack of 3
4 Agate Mortar and Pestle 2× Grinds and mixes precursor powders by hand and regrinds fired pellets between firings. Core, set
5 Planetary Ball Mill 1× Mills precursor batches more uniformly than hand grinding and mechanically alloys intermetallic powders. Useful
6 Milling Jars 2× Holds the powder and grinding balls while the planetary mill runs. Useful
7 Milling Media 2× Mixes the powder and reduces its particle size inside the jar while the planetary mill runs. Useful, set
8 Test Sieves 1× Removes agglomerates and sets an upper particle size before pressing or powder X-ray diffraction. Optional, set
9 Hydraulic Pellet Press 1× Presses ground powder in a die into pellets for firing and for resistance and susceptibility measurements. Core
10 Pellet Die Sets 2× Shapes the powder into a pellet of fixed diameter under the press. Core, set
11 Low-Speed Diamond Saw 1× Cuts rectangular bars from sintered pellets for four-probe resistance measurements with little chipping or heating. Useful
12 Diamond Wafering Blade 2× Cuts the sintered pellet with a thin diamond-edged rim when mounted on the low-speed saw. Useful
13 Mounting Wax 1× Holds a pellet on the saw's mounting block during cutting and releases it when reheated. Useful, 90 g
14 Saw Cutting Fluid 1× Cools and lubricates the blade while a sintered pellet is cut into bars. Useful, 16 oz
15 Silicon Carbide Abrasive Paper 3× Flattens pellet faces, trims bars to size and removes the reacted surface layer before electrical contacts are applied. Core, box of 25
16 Digital Caliper 1× Measures pellet and bar dimensions, needed to convert resistance to resistivity and to calculate geometric density. Core

3D model

No 3D model yet. Have a CAD file of this? Add a 3D model. STL renders right on this page; STEP, FreeCAD, and OpenSCAD sources are welcome too (openly licensed, like all 3D models on BOMwiki).

Build & assembly graph

expand / collapse · shared sub-assemblies converge · links to related products · est. labour
product / assembly shared across products atomic part related product

Tap an assembly to expand/collapse · tap a part to open it · use “Open page” for any node · drag to pan, scroll to zoom.

Bill of materials for Powder Preparation and Shaping

16 top-level lines · 60 rows shown · 78 parts total · indented to 3 levels
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 Analytical Balance 12 parts analytical-balance 1× 1 54 product
1.1 Housing 5 parts analytical-balance-housing 1× 1 7 assembly
1.1.1 Base Casting analytical-balance-base-casting 1× 1 · part
1.1.2 Top Cover analytical-balance-top-cover 1× 1 · part
1.1.3 Leveling Foot analytical-balance-leveling-feet 3× 3 · part
1.1.4 Bubble Level analytical-balance-bubble-level 1× 1 · part
1.1.5 Fastener Set fastener-set 1× 1 · part
1.2 Weigh Cell 7 parts analytical-balance-weigh-cell 1× 1 12 assembly
1.2.1 Lever Mechanism analytical-balance-lever-mechanism 1× 1 · part
1.2.2 Force Coil analytical-balance-force-coil 1× 1 · part
1.2.3 Neodymium Magnet neodymium-magnet 1× 1 · part
1.2.4 Position Sensor analytical-balance-position-sensor 1× 1 · part
1.2.5 Calibration Mechanism 4 parts + deeper › analytical-balance-cal-mechanism 1× 1 6 assembly
1.2.6 Coil Spring coil-spring 1× 1 · part
1.2.7 Fastener Set fastener-set 1× 1 · part
1.3 Pan Assembly 3 parts analytical-balance-pan-assembly 1× 1 3 assembly
1.3.1 Weighing Pan analytical-balance-weighing-pan 1× 1 · part
1.3.2 Pan Support analytical-balance-pan-support 1× 1 · part
1.3.3 Shield Coupling analytical-balance-shield-coupling 1× 1 · part
1.4 Draft Shield 4 parts analytical-balance-draft-shield 1× 1 10 assembly
1.4.1 Draft Shield Frame analytical-balance-shield-frame 1× 1 · part
1.4.2 Glass Door analytical-balance-glass-door 3× 3 · part
1.4.3 Door Slide analytical-balance-shield-slide 3× 3 · part
1.4.4 Door Handle analytical-balance-door-handle 3× 3 · part
1.5 Main Board 6 parts analytical-balance-main-board 1× 1 9 assembly
1.5.1 Bare PCB pcb-bare 1× 1 · part
1.5.2 Microcontroller mcu 1× 1 · part
1.5.3 High-Resolution ADC analytical-balance-hires-adc 1× 1 · part
1.5.4 Temperature Sensor analytical-balance-temp-sensor 1× 1 · part
1.5.5 SMD Passive (R/C/L) smd-passives 1× 1 · part
1.5.6 Connector connector 4× 4 · part
1.6 Display Module 4 parts analytical-balance-display 1× 1 4 assembly
1.6.1 LCD Panel lcd-panel 1× 1 · part
1.6.2 Touch Digitizer touch-digitizer 1× 1 · part
1.6.3 Display Bezel analytical-balance-display-bezel 1× 1 · part
1.6.4 Connector connector 1× 1 · part
1.7 Keypad analytical-balance-keypad 1× 1 · part
1.8 Level Sensor analytical-balance-level-sensor 1× 1 · part
1.9 Static Ionizer analytical-balance-ionizer 1× 1 · part
1.10 Interface Board 3 parts analytical-balance-interface-board 1× 1 4 assembly
1.10.1 Bare PCB pcb-bare 1× 1 · part
1.10.2 I/O Port Cluster analytical-balance-io-ports 1× 1 · part
1.10.3 Connector connector 2× 2 · part
1.11 Power Supply power-supply 1× 1 · part
1.12 Wire Bundle wire-bundle 1× 1 · part
2 Weighing Paper weighing-paper 2× 2 · part
3 Micro Spatulas micro-spatulas 2× 2 · part
4 Agate Mortar and Pestle agate-mortar-and-pestle 2× 2 · part
5 Planetary Ball Mill planetary-ball-mill 1× 1 · part
6 Milling Jars milling-jars 2× 2 · part
7 Milling Media milling-media 2× 2 · part
8 Test Sieves test-sieves 1× 1 · part
9 Hydraulic Pellet Press hydraulic-pellet-press 1× 1 · part
10 Pellet Die Sets pellet-die-sets 2× 2 · part
11 Low-Speed Diamond Saw low-speed-diamond-saw 1× 1 · part
12 Diamond Wafering Blade diamond-wafering-blade 2× 2 · part
13 Mounting Wax mounting-wax 1× 1 · part
14 Saw Cutting Fluid saw-cutting-fluid 1× 1 · part
15 Silicon Carbide Abrasive Paper silicon-carbide-abrasive-paper 3× 3 · part
16 Digital Caliper digital-caliper 1× 1 · part

Where the powder preparation and shaping is used

1 product across 1 domain contain it, directly or inside a sub-assembly

Used in 1 assembly

Sourcing: possible vendors

Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work
VendorHQSpecialtyMOQLead time
🇨🇳Foxconn
foxconn.com ↗
Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
flex.com ↗ Singapore Electronics contract mfg 1,000 pcs 6–10 wks
dixoninfo.com ↗ Noida, IN Electronics contract mfg 1,000 pcs 6–10 wks
bydelectronic.com ↗ Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
🇸🇬Venture Corp
venture.com.sg ↗
Singapore Electronics contract mfg 1,000 pcs 6–10 wks