Inspection and Diversion Unit
AssemblyOptical sensors check each cup for blood, rot or shell, then divert rejects. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Inspection and Diversion Unit parts and their functions
8 top-level parts · 94 parts in total · full bill of materials below
| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Blood and Rot Optical Sensor | 36× | Per-cup blood and rot sensors |
| 2 | Cup Divert Valve | 36× | Cup divert valves |
| 3 | Reject Trough | 1× | Reject collection trough |
| 4 | Bare PCB | 4× | Sensor interface boards |
| 5 | Microcontroller | 4× | Sensor processing controllers |
| 6 | SMD Passive (R/C/L) | 4× | Board passives |
| 7 | Connector | 8× | Sensor connectors |
| 8 | Wire Bundle | 1× | Sensor harness |
3D model
No 3D model yet. Have a CAD file of this? Add a 3D model. STL renders right on this page; STEP, FreeCAD, and OpenSCAD sources are welcome too (openly licensed, like all 3D models on BOMwiki).
Build & assembly graph
expand / collapse · shared sub-assemblies converge · links to related products · est. labour
product / assembly
shared across products
atomic part
related product
Tap an assembly to expand/collapse · tap a part to open it · use “Open page” for any node · drag to pan, scroll to zoom.
Bill of materials for Inspection and Diversion Unit
8 top-level lines · 8 rows shown · 94 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Blood and Rot Optical Sensor | egg-breaking-line-blood-sensor | 36× | 36 | · | part |
| 2 | Cup Divert Valve | egg-breaking-line-divert-valve | 36× | 36 | · | part |
| 3 | Reject Trough | egg-breaking-line-reject-trough | 1× | 1 | · | part |
| 4 | Bare PCB | pcb-bare | 4× | 4 | · | part |
| 5 | Microcontroller | mcu | 4× | 4 | · | part |
| 6 | SMD Passive (R/C/L) | smd-passives | 4× | 4 | · | part |
| 7 | Connector | connector | 8× | 8 | · | part |
| 8 | Wire Bundle | wire-bundle | 1× | 1 | · | part |
Something wrong in this list? Report a problem with this BOM.
Where the inspection and diversion unit is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |