Drop-Cup Ejection

Assembly

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Trips each cup over the lane assigned to its grade.

Direct parts	5
Total parts	376
Used in	1 assembly
Class	Assembly

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Trips each cup over the lane assigned to its grade. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Drop-Cup Ejection parts and their functions

5 top-level parts · 376 parts in total · full bill of materials below

Drop-Cup Ejection parts diagram: 1 trip actuator, 2 trip bar, 3 eject solenoid, 4 ejection controller, 5 wire bundle. 376 parts in 5 top-level items. — Drop-Cup Ejection parts diagram. Numbers match the table below; each box is one top-level part or assembly with what it contains.

#	Part	Qty	What it does
1	Trip Actuator 3 parts	32×
2	Trip Bar	16×
3	Eject Solenoid	32×	Coil that swings a trip finger into the cup follower.
4	Ejection Controller 6 parts	1×
5	Wire Bundle	1×	Group of insulated conductors cut to length, terminated, and bound together to carry power and signals between the assemblies of a machine.

3D model

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Build & assembly graph

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Bill of materials for Drop-Cup Ejection

5 top-level lines · 14 rows shown · 376 parts total · indented to 3 levels

#	Item / sub-assembly	Part no.	Qty/assy	Ext. qty	Parts	Type
1	Trip Actuator 3 parts	fruit-grading-line-trip-actuator	32×	32	3	assembly
1.1	Eject Solenoid	fruit-grading-line-eject-solenoid	1×	32	·	part
1.2	Trip Finger	fruit-grading-line-trip-finger	1×	32	·	part
1.3	Coil Spring	coil-spring	1×	32	·	part
2	Trip Bar	fruit-grading-line-trip-bar	16×	16	·	part
3	Eject Solenoid	fruit-grading-line-eject-solenoid	32×	32	·	part
4	Ejection Controller 6 parts	fruit-grading-line-eject-controller	1×	1	231	assembly
4.1	Bare PCB	pcb-bare	1×	1	·	part
4.2	Microcontroller	mcu	1×	1	·	part
4.3	Relay	relay	16×	16	·	part
4.4	Power MOSFET	mosfet	32×	32	·	part
4.5	CAN Transceiver	can-transceiver	1×	1	·	part
4.6	SMD Passive (R/C/L)	smd-passives	180×	180	·	part
5	Wire Bundle	wire-bundle	1×	1	·	part

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Where the drop-cup ejection is used

1 product across 1 domain contain it, directly or inside a sub-assembly

Food & Beverage Processing 1 Fruit Grading Line

Used in 1 assembly

Fruit Grading Line

Sourcing: possible vendors

Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work

Vendor	HQ	Specialty	MOQ	Lead time
🇨🇳Foxconn foxconn.com ↗	Shenzhen, CN	Electronics contract mfg	1,000 pcs	6–10 wks
🇸🇬Flex (Singapore) flex.com ↗	Singapore	Electronics contract mfg	1,000 pcs	6–10 wks
🇮🇳Dixon Technologies dixoninfo.com ↗	Noida, IN	Electronics contract mfg	1,000 pcs	6–10 wks
🇨🇳BYD Electronics bydelectronic.com ↗	Shenzhen, CN	Electronics contract mfg	1,000 pcs	6–10 wks
🇸🇬Venture Corp venture.com.sg ↗	Singapore	Electronics contract mfg	1,000 pcs	6–10 wks