Image Processing & Detection
AssemblyElectronics that take the camera and sensor lines, classify each pixel as good, defect or foreign, group pixels into objects, and compute exactly which ejector valves must fire and when as each rejected piece reaches the air knife. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Image Processing & Detection parts and their functions
5 top-level parts · 854 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | FPGA Processing Board 3 parts | 1× | FPGA processing board |
| 2 | GPU Classification Board 3 parts | 1× | GPU classification board |
| 3 | Valve Driver Board 4 parts | 4× | Valve driver boards |
| 4 | Frame Grabber 3 parts | 1× | Frame grabber |
| 5 | Wire Bundle | 1× | Internal wiring |
3D model
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Bill of materials for Image Processing & Detection
5 top-level lines · 18 rows shown · 854 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | FPGA Processing Board 3 parts | optical-sorting-machine-food-fpga-board | 1× | 1 | · | part |
| 1.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 1.2 | SMD Passive (R/C/L) | smd-passives | 200× | 200 | · | part |
| 1.3 | Connector | connector | 6× | 6 | · | part |
| 2 | GPU Classification Board 3 parts | optical-sorting-machine-food-gpu-board | 1× | 1 | · | part |
| 2.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 2.2 | SMD Passive (R/C/L) | smd-passives | 180× | 180 | · | part |
| 2.3 | Connector | connector | 4× | 4 | · | part |
| 3 | Valve Driver Board 4 parts | optical-sorting-machine-food-valve-driver | 4× | 4 | · | part |
| 3.1 | Bare PCB | pcb-bare | 1× | 4 | · | part |
| 3.2 | Microcontroller | mcu | 1× | 4 | · | part |
| 3.3 | SMD Passive (R/C/L) | smd-passives | 90× | 360 | · | part |
| 3.4 | Connector | connector | 4× | 16 | · | part |
| 4 | Frame Grabber 3 parts | optical-sorting-machine-food-frame-grabber | 1× | 1 | · | part |
| 4.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 4.2 | SMD Passive (R/C/L) | smd-passives | 70× | 70 | · | part |
| 4.3 | Connector | connector | 6× | 6 | · | part |
| 5 | Wire Bundle | wire-bundle | 1× | 1 | · | part |
Where the image processing & detection is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $1–$80. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
| sunnyoptical.com ↗ | Ningbo, CN | Optics & camera modules | 1,000 pcs | 8–12 wks |
|
🇨🇳OFILM
ofilm.com ↗
|
Shenzhen, CN | Camera modules | 1,000 pcs | 8–12 wks |
| vvdntech.com ↗ | Gurugram, IN | Electronics & camera modules | 1,000 pcs | 8–12 wks |
| truly.net ↗ | Shanwei, CN | Displays & camera modules | 1,000 pcs | 8–12 wks |
| aactechnologies.com ↗ | Singapore | Acoustics & optics | 1,000 pcs | 8–12 wks |