CIP / SIP Circuit
AssemblyCleaning-in-place and sterilization-in-place circuit serving the full product path. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
CIP / SIP Circuit parts and their functions
6 top-level parts · 36 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | CIP Tank | 2× | Caustic and acid CIP tanks |
| 2 | CIP Pump 5 parts | 1× | CIP supply pump |
| 3 | CIP Heater | 1× | Inline CIP solution heater |
| 4 | Dosing Pump | 2× | Caustic and acid dosing pumps |
| 5 | Conductivity Sensor | 1× | Return conductivity sensor |
| 6 | Heating Element | 4× | CIP heater immersion elements |
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Bill of materials for CIP / SIP Circuit
6 top-level lines · 18 rows shown · 36 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | CIP Tank | uht-processing-system-cip-tank | 2× | 2 | · | part |
| 2 | CIP Pump 5 parts | uht-processing-system-cip-pump | 1× | 1 | 26 | assembly |
| 2.1 | Pump Casing | uht-processing-system-pump-casing | 1× | 1 | · | part |
| 2.2 | Pump Impeller | uht-processing-system-pump-impeller | 1× | 1 | · | part |
| 2.3 | Stator Assembly 3 parts | stator-assembly | 1× | 1 | 3 | assembly |
| 2.3.1 | Stator Core (laminations) | stator-core | 1× | 1 | · | part |
| 2.3.2 | Copper Winding | copper-winding | 1× | 1 | · | part |
| 2.3.3 | Slot Insulation | stator-insulation | 1× | 1 | · | part |
| 2.4 | Rotor Assembly 4 parts | rotor-assembly | 1× | 1 | 19 | assembly |
| 2.4.1 | Rotor Shaft | rotor-shaft | 1× | 1 | · | part |
| 2.4.2 | Rotor Core | rotor-core | 1× | 1 | · | part |
| 2.4.3 | Neodymium Magnet | neodymium-magnet | 16× | 16 | · | part |
| 2.4.4 | Ball Bearing | ball-bearing | 1× | 1 | · | part |
| 2.5 | Ball Bearing | ball-bearing | 2× | 2 | · | part |
| 3 | CIP Heater | uht-processing-system-cip-heater | 1× | 1 | · | part |
| 4 | Dosing Pump | uht-processing-system-dosing-pump | 2× | 2 | · | part |
| 5 | Conductivity Sensor | uht-processing-system-conductivity-sensor | 1× | 1 | · | part |
| 6 | Heating Element | heating-element | 4× | 4 | · | part |
Where the CIP / SIP circuit is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |