Plating Tank Assembly
AssemblyContains dissolved nickel or copper salt and chemical reducing agent for controlled deposition. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Plating Tank Assembly
5 top-level lines as of r56756| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Plating Vessel | electroless-plating-line-plating-vessel | 1× | 1 | · | part |
| 2 | Plating Heater | electroless-plating-line-plating-heater | 2× | 2 | · | part |
| 3 | Main Circulation Pump | electroless-plating-line-circulation-pump-main | 1× | 1 | · | part |
| 4 | pH Controller | electroless-plating-line-ph-controller | 1× | 1 | · | part |
| 5 | Main Filter Cartridge | electroless-plating-line-filter-main | 1× | 1 | · | part |