Process PLC
AssemblyController sequencing heating, stirring, and alloy additions over the treatment. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Process PLC
4 top-level lines as of r94954| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 2 | Microcontroller | mcu | 2× | 2 | · | part |
| 3 | Relay | relay | 10× | 10 | · | part |
| 4 | SMD Passive (R/C/L) | smd-passives | 170× | 170 | · | part |