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Loader Module

Assembly

Automatic FOUP interface and wafer shuttle mechanism for loading 25-150mm diameter wafers into the chuck. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Bill of materials for Loader Module

4 top-level lines as of r185999
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 Robotic Arm wafer-prober-carrier-arm 1× 1 · part
2 FOUP Dock wafer-prober-foup-interface 1× 1 · part
3 Linear Shuttle wafer-prober-linear-shuttle 1× 1 · part
4 Blower Motor blower-motor 1× 1 · part