Substrate Cooling & Thermal Control
AssemblyWater-cooled copper clamp holding substrate at 100–300 °C, reducing residual stress and distortion. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Substrate Cooling & Thermal Control
5 top-level lines as of r190721| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Coolant Pump | coolant-pump | 1× | 1 | · | part |
| 2 | Radiator | radiator | 1× | 1 | · | part |
| 3 | Pressure Sensor | pressure-sensor | 1× | 1 | · | part |
| 4 | Connector | connector | 2× | 2 | · | part |
| 5 | Fastener Set | fastener-set | 2× | 2 | · | part |